Wafer Cleaning: Wet Methods Still Lead the Pack
نویسنده
چکیده
As feature sizes continue their frantic descent into the sub-0.6 pm region, wafer cleaning is on its way toward becoming a true enabling technology. Ridding wafers of the i r process chemicals is one of the most common steps in fabrication. It’s also, often a dirty one, in terms of picking up contaminants. The heavy metals, alkali metals and light elements, all common to wafer processing, also threaten silicon devices (Table 1). Wafer cleaning systems can be a major source of submicron particulates that are difficult to detect. One way to detect them, says Paul Paduano, diffusion section head of Micpon Semiconductor, is with a deposited film to “decorate” the defects.
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